CD-02-05-C-18 Fiyatlandırma (USD) [246108adet Stok]
- 1 pcs$0.15029
- Parça numarası:
- CD-02-05-C-18
- Üretici firma:
- Wakefield-Vette
- Detaylı Açıklama:
- THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
- Üreticinin standart teslim süresi:
- Stokta var
- Raf ömrü:
- Bir yıl
- Gönderen Çip:
- Hong Kong
- RoHS:
- Ödeme şekli:
-
- Sevkiyat yolu:
- Aile Kategorileri:
- KEY Components Co, LTD dahil olmak üzere ürün kategorileri sunan bir Elektronik Bileşenler Dağıtıcısı: Termal - Termoelektrik, Peltier Montajları, AC Fanlar, Termal - Yapıştırıcılar, Epoksi, Gresler, Pastalar, Termal - Sıvı Soğutma, Termal - Yapıştırıcılar, Epoksi, Gresler, Pastalar, Termal - Termoelektrik, Peltier Modülleri, DC Fanlar and Termal - Pedler, Levhalar ...
- Rekabet avantajı:
- We specialize in Wakefield-Vette CD-02-05-C-18 electronic components. CD-02-05-C-18 can be shipped within 24 hours after order. If you have any demands for CD-02-05-C-18, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
CD-02-05-C-18 Ürün özellikleri
Parça numarası :
CD-02-05-C-18
Üretici firma :
Wakefield-Vette
Açıklama :
THERM PAD 0.689 X 0.689
Dizi :
ulTIMiFlux™
Parça Durumu :
Active
kullanım :
-
tip :
Pad, Sheet
şekil :
Square
taslak :
17.50mm x 17.50mm
Kalınlık :
0.0030" (0.076mm)
Malzeme :
Phase Change Compound
yapıştırıcı :
-
Taşıyıcı, Taşıyıcı :
Polyimide
Renk :
Orange
Termal direnç :
-
Termal iletkenlik :
-
Son Haberler
Ayrıca ilginizi çekebilir
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CD-02-05-C-18
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-220-N
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THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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CD-02-05-C-22
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THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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CD-02-05-C-20
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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